The Giga-snap SFS-BGA200B-52 socket allows an 11 x 14.5-mm, 200-ball BGA IC with a 0.65-mm pitch, 12 x 22-array to be placed in a socket with the same footprint as the IC to avoid compromising ...

BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...

Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...

The BGA component serves the primary role of redistributing the signals from the die it protects to an interface pattern (the BGA’s balls) compatible with the host PCB it mounts on. As a result, many ...

BGA sockets simplify evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin sockets. BGA sockets come with easy open/close clamshell lids for ...

TDA Systems Inc. of Portland, Ore., is developing a time domain reflectometry (TDR) software prototype for detecting defects in ball-grid-array (BGA) IC packages. TDR measurement is recognized as an ...

Revenues generated at Unimicron Technology's new flip-chip ball-grid array (FC BGA) substrate plant will reach NT$500 million (US$15.3 million) per month in 2016, up from about NT$350 million in ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

Due to rising costs for plastic ball-grid array (PBGA) substrates, prices for ball-grid array (BGA) packaging in Taiwan may increase from mid-March, said sources at first-tier packaging and testing ...